A fab lab features a clean room where the environment is controlled to eliminate dust and vibration and keep the temperature and humidity within a narrow range. In the clean room, the integrated circuits are etched onto wafers through photolithography, a process that involves photographing the circuit pattern on a photosensitive substrate and chemically etching away the background. The completed chips are sent to a back-end assembly and test facility.
By submitting your personal information, you agree that TechTarget and its partners may contact you regarding relevant content, products and special offers.
The types of chips manufactured at a fab include NAND flash, DRAM for main memory, microprocessor, graphics controller, hard drive controller and RAID controller. Such chips go into a wide range of devices, such as computers, solid-state drives, hard disk drives, mobile phones, televisions and automobiles.